On this page of StockholderLetter.com we present the latest annual shareholder letter from KULICKE & SOFFA INDUSTRIES INC — ticker symbol KLIC. Reading current and past KLIC letters to shareholders can bring important insights into the investment thesis.

 •  1/22/2026 Letter Continued (Full PDF)
 •  1/19/2023 KLIC Stockholder Letter
 •  1/22/2024 KLIC Stockholder Letter
 •  1/15/2025 KLIC Stockholder Letter
 •  More "Semiconductors" Category Stockholder Letters
 •  KLIC Benford's Law Stock Score = 95

KLIC Shareholder/Stockholder Letter Transcript:

2025 Annual Report

Vision
To innovate for a smarter, more
connected future.
Company
Founded in 1951, Kulicke & Soffa specializes
in developing cutting-edge semiconductor
and electronics assembly solutions enabling
a smart and more sustainable future. Our
ever-growing range of products and services
supports growth and facilitates technology
transitions across large-scale markets, such
as automotive, communications, compute,
consumer, data storage, energy storage and
industrial. Kulicke & Soffa is headquartered in
Pennsylvania and Singapore.

Dear Shareholders:
Fiscal year 2025 was a pivotal
year for Kulicke & Soffa.
We navigated a dynamic
semiconductor landscape while
advancing strategic priorities.
Despite an extended period of
softer demand across several
end markets, we continued to
release new innovations and
drove market engagements
across our highest growth
opportunities.
These efforts are adding depth to our solutions portfolio
while also enhancing the value of the semiconductor
assembly process. Our ability to execute new initiatives
and drive this progress amid challenging market
conditions underscores the resilience of our business
model and breadth of our growing market access.
Our long-term strategy of driving technological
transitions through innovation is accelerating,
broadening our market reach and strengthening
our competitive positions. Through fiscal 2025, we
delivered several innovative market solutions within
thermocompression, vertical wire, advanced dispense
and high-power interconnect. By delivering cuttingedge solutions and maintaining disciplined operational
and capital allocation strategies, we are actively
enhancing our ability to create sustainable long-term
shareholder value.
Fiscal Year 2025 Strategic Progress
and Achievements
Over the past year, we remained committed to
delivering shareholder returns and deployed $96.5
million to repurchase 2.4 million shares, nearly 5%
of shares outstanding. In parallel, we recorded
an additional $43.3 million, or $0.82 per share, of
consistent dividend payments over the same period.
This demonstrates our confidence in the Company   s
long-term prospects and our commitment to delivering
direct shareholder value.
The Ball Bonding market experienced steady
improvement during fiscal 2025, rebounding from a
period of soft demand that began at the onset of fiscal
2023. Over the past three years, utilization of our largest
installed base has strengthened with rising demand
from general semiconductor and memory markets.

Wire bonding technology continues to advance with
our latest vertical wire process, which provides a costeffective solution for stacked-die applications and
expands access across memory opportunities.
Within Wedge Bonding, we released the AsterionPW which enables the transition to smarter, more
efficient, power semiconductor opportunities growing
in demand due to evolving automotive and industrial
trends. While broad automotive and industrial end
market headwinds persisted through fiscal year 2025,
we are now cautiously optimistic in an industrysupported recovery through fiscal 2026. Long-term,
we remain very confident in our technology leadership
which supports electric vehicle and clean-technology
transitions. Additionally, we were pleased to launch the
ACELON    advanced dispense system, which leverages
our industry-proven wedge bonding platform. This new
system reflects our commitment to next-generation
solutions, while highlighting our ability to expand
market access.
Within Advanced Solutions, our market engagements
continue to expand. Our solutions are in development
and/or production of several of the most advanced
logic and next-generation memory applications.
Emerging technology requirements for artificial
intelligence, combined with the growing necessity for
More-than-Moore assembly techniques, such as ultrafine pitch interconnects and advanced heterogeneous
integration, are reshaping the semiconductor landscape.
Our fluxless thermocompression (FTC) solutions, in
addition to our AT Premier MEM Plus    vertical wire
system, position K&S at the forefront of two separate
advanced packaging transitions. Additionally, we
recently shipped our first HBM system in the December
quarter and continue to anticipate vertical wire will
enter high-volume production in late calendar year
2026, providing separate paths to grow share in the
advanced memory market.
These broad technology transitions within general
semiconductor, memory and automotive and industrial
markets, in addition to our growing portfolio of
solutions are fortifying our growth platform across
served markets.
Positioned for Growth:
Outlook into Fiscal Year 2026
Looking ahead into fiscal 2026, we currently anticipate
half of our sequential annual revenue growth to
stem from fundamental technology transitions and
new market opportunities explained above, while
the remainder is anticipated to stem from improving
dynamics within the sizeable Ball and Wedge markets.
We are optimistic as we look into 2026. The entire K&S
organization is well-positioned to capitalize on significant
industry transitions enabling chiplet architecture,
heterogeneous integration, and high-bandwidth memory
in addition to pursuing several exciting opportunities
through the rapidly evolving automotive and clean-tech
markets. Our focus remains on delivering innovative
solutions across our served markets to advance the
semiconductor assembly process.
We thank you for your continued trust and support as
we execute our strategy to create and deliver long-term
value by aligning technology with opportunity.
Sincerely,
Lester Wong
Interim Chief Executive Officer & Chief Financial Officer
Kulicke and Soffa Industries, Inc.



 1/22/2026 Letter Continued (Full PDF)